ECN - September 2017

DATEL Inc. has introduced a Quarter Brick (QB) series that can deliver up to 150 watts of power. Offering a wide 9 to 36 V or 18 to 75 V input range, this QB series delivers efficiencies up to 92 percent. The standard output voltages are 5, 12, 24, 28, and 48 volts that can be trimmed to a required voltage.

This QB series operates over the extended temperature of -40°C to +105°C. It features a positive or negative On/Off Control function and 2250 VDC of isolation. All models have internal overcurrent and continuous short circuit protection.

Other options available from DATEL include models optimized for lower cost, higher power models using (2:1) input ranges, lower power/cost (75 Watt and 100 Watt family is available in 4:1 Vin), 60

Watt to 100 Watt versions for railway applications with 43 to 160 VDC inputs or 66 to 160 VDC inputs.

For more information, visit www.datel.com.

Internal IFP Cable Assemblies Cut System Design Time, Cost

TE Connectivity announced its ChipConnect internal faceplate-to-processor (IFP) cable assemblies. Designed for Intel Omni-Path Architecture (OPA), TE’s ChipConnect assemblies mate directly with LGA 3647 sockets at the processor and Intel Omni-Path internal faceplate transition (IFT) ports at the faceplate for 25

Gbps speeds. These cable assemblies reduce system design time and costs by eliminating the need to use costlier, lower-loss printed circuit board (PCB) materials and associated re-timers to route signal.

ChipConnect assemblies are available in standard lengths, breakouts, and can also be customized for specific applications. The new cable assemblies provide 4X and 8X high-speed data transmission lanes, and offer straight and right-angle (left/right exit) linear edge connector (LEC) cable plugs to accommodate cable routing. In addition to these cable assemblies, TE offers compatible LGA 3647 sockets and hardware (Socket P0 and P1).

TE is currently one of a limited number of Intel qualified suppliers offering these first-generation IFP cable assemblies and is also a development partner for future generation cable assembly designs for Intel OPA.

For more information, visit www.te.com.

KEY SPEC:

The converters offer input Under-Voltage Lock-Out (UVLO), and are fully protected against output overvoltage and over temperature conditions.

KEY SPEC:

System design is made easier by reducing the complexity of PCB laminates and routing.

SJ-Series of Preform Jumpers:

A Reliable, Affordable Solution for SMT Design Requirements

The reliable SJ-Series from Components Corporation is the first true surface mount jumper developed specifically for SMT applications, offering strength and stability when mounted.