DATEL Inc. has introduced a Quarter Brick (QB) series that can
deliver up to 150 watts of power. Offering a wide 9 to 36 V or 18
to 75 V input range, this QB series delivers efficiencies up to 92
percent. The standard output voltages are 5, 12, 24, 28, and 48 volts
that can be trimmed to a required voltage.
This QB series operates over the extended temperature of -40°C
to +105°C. It features a positive or negative On/Off Control function
and 2250 VDC of isolation. All models have internal overcurrent and
continuous short circuit protection.
Other options available from DATEL include models optimized
for lower cost, higher power models using (2:1) input ranges, lower
power/cost (75 Watt and 100 Watt family is available in 4:1 Vin), 60
Watt to 100 Watt versions for railway applications with 43 to 160 VDC
inputs or 66 to 160 VDC inputs.
For more information, visit www.datel.com.
Internal IFP Cable Assemblies
Cut System Design Time, Cost
TE Connectivity announced its
ChipConnect internal faceplate-to-processor (IFP) cable assemblies.
Designed for Intel Omni-Path
Architecture (OPA), TE’s ChipConnect
assemblies mate directly with LGA
3647 sockets at the processor and Intel
Omni-Path internal faceplate transition
(IFT) ports at the faceplate for 25
Gbps speeds. These cable assemblies
reduce system design time and costs
by eliminating the need to use costlier,
lower-loss printed circuit board (PCB)
materials and associated re-timers to
route signal.
ChipConnect assemblies are available
in standard lengths, breakouts, and
can also be customized for specific
applications. The new cable assemblies
provide 4X and 8X high-speed data
transmission lanes, and offer straight
and right-angle (left/right exit) linear
edge connector (LEC) cable plugs to
accommodate cable routing. In addition
to these cable assemblies, TE offers
compatible LGA 3647 sockets and
hardware (Socket P0 and P1).
TE is currently one of a limited number
of Intel qualified suppliers offering these
first-generation IFP cable assemblies
and is also a development partner
for future generation cable assembly
designs for Intel OPA.
For more information,
visit www.te.com.
KEY SPEC:
The converters offer input Under-Voltage Lock-Out (UVLO), and
are fully protected against output
overvoltage and over temperature
conditions.
KEY SPEC:
System design is made easier by
reducing the complexity of PCB
laminates and routing.
SJ-Series of Preform Jumpers:
A Reliable, Affordable Solution for SMT Design Requirements
The reliable SJ-Series from Components Corporation is the first
true surface mount jumper developed specifically for SMT
applications, offering strength and stability when mounted.
6 Kinsey Place, Denville, NJ 07834-2692
866-426-6726
www.componentscorp.com
DESIGNED FOR VALUE.
VALUED FOR PERFORMANCE.
• Ultra-low profile with
sufficient clearance for
circuit paths.
• No insulation required.
• Available in 1206 and
0805 package sizes.
• RoHS/Reach/Conflict
Materials compliant.
COMPONENTS
CORPORATION C C®
COMPONENTS
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